Diploma 3 Manufacturing Electronics Engineering

PROFESSIONAL INDEPENDENT PROFILE

1. Graduates will have a successful career in their profession in the field of electronics manufacturing or related fields.
2. Graduates will apply problem-solving skills, critical thinking, communication, and management to address technical issues related to the field of electronics manufacturing.
3. Graduates will demonstrate leadership and actively contribute to the improvement of their communities and the industry.

LEARNING OUTCOMES

Aspect of Attitudes

1. Devout to God Almighty and capable of demonstrating religious attitudes.
2. Uphold human values in carrying out duties based on religion, morality, and ethics.
3. Contribute to improving the quality of life in society, the nation, the state, and civilization based on Pancasila.
4. Act as citizens who are proud and love their country, possess nationalism, and a sense of responsibility toward the nation and state.
5. Respect cultural diversity, viewpoints, religions and beliefs, as well as the original opinions or findings of others.
6. Collaborate and exhibit social sensitivity and concern for the community and environment.
7. Abide by laws and maintain discipline in social and national life.
8. Internalize academic values, norms, and ethics.
9. Demonstrate responsibility for work in their area of expertise independently.
10. Internalize the spirit of independence, perseverance, and entrepreneurship.

Aspect of Knowledge

1. Master the theoretical concepts of mathematics and applied sciences generally.
2. Master theoretical concepts of semiconductor fabrication and radio-frequency microelectronics technology.
3. Master general concepts of knowledge, techniques, skills, engineering, and technology in the field of electronics manufacturing, including IC Packaging, PCB Manufacturing, and Assembly.
4. Master general concepts, methods, and technologies for solving problems in the field of electronics manufacturing, including IC Packaging, PCB Manufacturing, and Assembly.
5. Master general concepts of engineering design for systems, components, or processes in electronics manufacturing, including IC Packaging, PCB Manufacturing, and Assembly.
6. Master general concepts, principles, and techniques of written, oral, and graphical communication in technical and non-technical environments in both Indonesian and English.
7. Master theoretical concepts of literacy skills, including information, digital, and media literacy, in general technical and non-technical environments.
8. Master theoretical concepts of testing, measurement, and experimentation according to standards, including IPC, JEDEC, and other standards related to electronics manufacturing.
9. Master general concepts of analyzing and interpreting test, measurement, and experimental results.
10. Master general concepts of collaboration and teamwork.

Aspect of General Skills

1. Capable of completing a wide range of tasks and analyzing data using appropriate methods, both established and non-established.
2. Capable of demonstrating quality and measurable performance.
3. Able to solve work-related problems in alignment with the characteristics and context of their applied expertise based on logical, innovative thinking and independently responsible for the outcomes.
4. Capable of preparing accurate and valid reports on work processes and results and communicating them effectively to relevant parties.
5. Able to collaborate, communicate, and innovate in their work.
6. Capable of being responsible for the achievement of group work outcomes and supervising and evaluating tasks assigned to subordinates.
7. Capable of self-evaluation in workgroups under their responsibility and managing professional competency development independently.
8. Capable of documenting, storing, securing, and retrieving data to ensure validity and prevent plagiarism.

Aspect of Specific Skills

1. Capable of applying knowledge, techniques, skills, mathematics, science, engineering, and technology to solve well-defined technical problems in electronics manufacturing.
2. Capable of designing solutions for well-defined technical problems and contributing to the engineering design of systems, components, or processes in electronics manufacturing.
3. Capable of written, oral, and graphical communication in well-defined technical and non-technical environments, and able to identify and use appropriate technical references.
4. Capable of conducting testing, measurement, and experimentation according to standards and analyzing and interpreting the results.
5. Capable of contributing effectively as a team member.

CAREER PROSPECTS

1. Technician in the IC Packaging industry or semiconductor industry.
2. Technician in the PCB Assembly or Surface Mount Technology (SMT) industry.

GRADUATE COMPETENCIES

The Diploma Three Program in Electronics Manufacturing Technology has two main competencies: competencies in the IC packaging industry and PCB Assembly (SMT).